[D&T] Thermal Modeling and Validation of A Real-World Mobile AP

 Young-Ho Gong, Jae Jeong Yoo, and Sung Woo Chung, "Thermal Modeling and Validation of A Real-World Mobile AP", IEEE Design & Test, vol. 35, no. 1, pp. 55-62, February 2018.​

Abstract​

As power density of microprocessors increases, on-chip temperature gets higher, resulting in thermal problems. To resolve the thermal problems, an accurate thermal model is necessary to analyze microprocessor temperature from the early-design stage. In this article, we implement an accurate thermal model of an off-the-shelf mobile application processor (AP) using HotSpot, based on the actual design information and directly measured power values. We validate our thermal model using an infrared (IR) camera as well as on-chip thermal sensors. We achieve an average error of 1.58˚C and 2.42˚C, compared to the measured temperature from an IR camera and thermal sensors, respectively.