"Practical Perspective on OS-level Power/Thermal Management for Mobile…
Practical Perspective on OS-level Power/Thermal Management for Mobile Devices
Speaker: Professor Sung Woo Chung
Korea University, Seoul, Korea
Thursday, October 6, 2016, 2pm- 3pm
George Mason University, VSE Room 3507
Abstract
There have been numerous researches on OS-level power/thermal management for mobile devices. Unfortunately, most of them have not been adopted, since they are too complicated to adopt or their system-wide gain seems marginal. On the other hand, power/thermal management techniques in off-the-shelf mobile devices are quite simple (e.g. changing frequency and voltage by looking at core utilization). In this talk, I will introduce smart OS-level power/thermal management techniques, which is applicable to real mobile devices. I will also show the experimental results
(NOT simulation results) on real mobile devices.
Bio
Sung Woo Chung is a professor of Department of Computer Science, Korea University, Seoul, Korea. He received his B.S. degree in Computer Engineering from Seoul National University, Seoul, Korea in 1996, and his Ph.D. degree in Electrical and Computer Engineering from Seoul National University in 2003. In 2002, he worked for IBM T.J. Watson Research Center, Yorktown Heights,
USA as an intern. Before joining in Korea University in 2006, he had worked for Samsung Electronics, Korea, as a senior engineer, where he architecturally enhanced ARM1136 and AXI (AMBA 3.0) for Samsung's SoC (System on Chip). He had also worked on temperature-aware architectures and systems as a research scientist in University of Virginia, Charlottesville, USA (with Prof. Kevin Skadron). He is a senior member of IEEE. He had served as an Associate Editor for IEEE Transactions on Computers. He was a program co-chair of ICCD 2015. He has been a TPC
member of various conferences including DAC (2015, 2016), ISLPED (2016), ICCD (2009~2014), and IPDPS (2015). His research interests include power-/thermal-aware hardware and software, power-efficient memory systems, and 3D integrations.
* Please refer to the details from attached file.