"System-level Thermal Modeling and Power/Thermal Management for Mobile…

SMRL 0 551
System-level Thermal Modeling and Power/Thermal Management for Mobile Devices

Speaker: Professor Sung Woo Chung

Korea University, Seoul, Korea 

Friday, February, 2019, 2:00 pm - 3:00 pm

Columbia University, Mudd Building (MUDD), EE conf. room (Rm. 1306)

Abstract

This talk consist of two parts: 1) thermal modeling and 2) power/thermal management. In the first part, we will present the practical thermal modeling techniques based on HotSpot, which we validated against a commercial application processor. In the second part, we will present the software-level power/thermal management techniques, which are not only easy to understand but also adopted by the industry. These techniques were also validated in the commercial smartphones.

 

Bio

Sung Woo Chung received the BS, MS, and Ph.D. degrees in Electrical Engineering and Computer Science from Seoul National University, in 1996, 1998, and 2003, respectively. He was a senior engineer in Samsung Electronics from 2003 to 2004. In 2005, He was a research scientist at the University of Virginia. Since 2006, he is a professor in the Department of Computer Science, Korea University, Seoul, Korea. His research interests include low-power design, temperature-aware design, and user-aware design. He was an Associate Editor of IEEE Transactions on Computers from 2010 to 2015. He was the Technical Program Co-Chair of the IEEE International Conference of Computer Design in 2015. He serves (and served) on the technical program committees in many conferences, including Design Automation Conference (2015-2018), International Symposium on Low Power Electronics and Design (2016-2019), and International Parallel and Distributed Processing Symposium (2017-2018). He is a senior member of IEEE.

 

* Please refer to the details from attached file.

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