System-level Thermal Modeling and Power/Thermal Management
Speaker: Professor Sung Woo Chung
Korea University, Seoul, Korea
Monday, 2nd, September, 2019, 2:00 pm
Singapore, National University of Singapore, 13 Computing Drive, Computing 1
This talk consists of two parts: 1) thermal modeling and 2) power/thermal management. In the first part, I will present our thermal modeling techniques based on HotSpot and show the validation results against a commercial application processor. In the second part, I will explain software power/thermal management techniques, which is easy to understand intuitively; I believe only simple techniques can be adopted by industry. In the mobile devices, multimedia applications are very popular, where there is a specific thread for audio playback. By detecting the thread, DVFS and scheduling are coordinated to save power consumption. And I will explain the difference between battery consumption and energy consumption, which should be carefully considered to evaluate battery lifetime. Lastly, I will present the state-of-the art thermal management techniques for mobile devices depending on migration as well as DVFS. All the evaluation results are based on measurement of commercial smartphones rather than simulation.
Sung Woo Chung received the BS, MS, and PhD degrees in Electrical Engineering and Computer Science from Seoul National University, in 1996, 1998, and 2003, respectively. He was a senior engineer in Samsung Electronics from 2003 to 2004. In 2005, He was a research scientist in University of Virginia. Since 2006, he is a professor in the Department of Computer Science, Korea University, Seoul, Korea. His research interests include low-power design, temperature-aware design, and user-aware design. He had been an Associate Editor of IEEE Transactions on Computers from 2010 to 2015. He was the Technical Program Co-Chair of the IEEE International Conference on Computer Design in 2015. He serves (and served) on the technical program committees in many conferences, including Design Automation Conference (2015-2018), International Symposium on Low Power Electronics and Design (2016-2019), and International Parallel and Distributed Processing Symposium (2017-2018). He is a senior member of IEEE.