Thuan Cong Do

congthuan.hut@gmail.com

• Computer Architecture
• Embedded Systems
• High-Performance Processors and CPU/GPGPU

Currently, tenure track faculty in Hanoi University of Science and Technology (HUST)

Joonho Kong

joonho.kong@gmail.com

• Thermal Attack in a microprocessor
• Process variation-aware architecture

Currently, tenure track faculty in Kyungpook National University

Hyung Beom Jang

kuphy01@korea.ac.kr

• Banked Register File with Leakage power
• Reliable Cache Architecture

Currently at Samsung Electronics DS

Jae Min Kim

joist@korea.ac.kr

• User-aware Power Management
• Mobile Power/Thermal Management

Currently at Samsung Electronics DS

Minyong Kim

mkim05@korea.ac.kr

• Battery-aware Power Management
• Mobile Power Management
• User-aware Power Management

Currently at Gehry Technologies

Young-Ho Gong

kyh555@korea.ac.kr

• Energy-efficient Next Generation Cache Architecture
• Low-power DRAM Refresh

Currently, tenure track faculty in Soongsil University

Young Geun Kim

younggeun_kim@korea.ac.kr

• Battery-aware Power Management
• Mobile Power/Thermal Management

Currently, tenure track faculty in Korea University

Young Seo Lee

leeyoungseo04@gmail.com

• 3D Stacked Architecture
• Processing in Memory (PIM)
• Temperature-aware Design

Currently, tenure track faculty in Soongsil University

Seung Hun Choi

csh30096@korea.ac.kr

• OS-level Thermal Management
• Thermal-aware VM Allocation

Currently at Samsung Electronics DS

Do Yeon Kim

doyonee@korea.ac.kr

• SSD Performance Evaluation

Currently, Socar

Jong Sung Lee

sayhappy@gmail.com

• SSD Performance Evaluation
• Temperature-aware DVFS

Currently, GE Appliances

Jin Hang Choi

cepiross@korea.ac.kr

• Migrating Computation
• Temperature-aware architecture

Currently at Nvidia

Soon Bo Shim

tlatnsqh@korea.ac.kr

• Designs on FPGA

Currently at Harman International Industries

Jun Hee Lee

junheelee@korea.ac.kr

• Power-aware CPU Overclocking

Currently at Qualcomm Korea

Gi Tae Oh

loveis333@korea.ac.kr

• Low-power DRAM Refresh

Currently at LG Electronics CTO

Seung Kyu Seo

marble33@korea.ac.kr

• Mobile Power Management

Currently at LG Electronics CTO

Jeonghan Kim

claret23@korea.ac.kr

• Mobile Power Management

Currently at Samsung Electronics DS

Sangnam Kim

snkim@korea.ac.kr

• Low-level Circuit Design

Currently at LG Electronics HE

Jae Jeong Yoo

jgeneration88@korea.ac.kr

• Mobile Power Management
• Mobile AP Thermal Modeling

Currently at Korea Securities Depository

Jaehoon Chung

jhchung15@korea.ac.kr

• Mobile Power Management
• High Bandwidth Memory Modeling
• DRAM-PRAM Hybrid Memory Modeling

Currently at ETRI

Duk Hun Kang

darren@korea.ac.kr

• Mobile Power Management

Currently at LG Electronics CTO

Sang Jun Nam

heesosic@korea.ac.kr

• Mobile Power Management

Currently at Samsung Electronics DS

Kyung Min Kim

kyoungmin2@naver.com

• 3D Stacked Architecture
• AI Accelerator

Currently at ETRI

Seung Gwon Kim

09labs@korea.ac.kr

• Battery Management System

Currently at Socar

Ji Heon Lee

dannyjh32@naver.com

• 3D Stacked Architecture
• High Bandwidth Memory (HBM)
• Processing in Memory (PIM)
• Temperature-aware Design

Currently at SK Hynix

Jeong Hwan Choi

cjh9407@gmail.com

• 3D Stacked Architecture
• High Bandwidth Memory (HBM)
• Processing in Memory (PIM)
• Temperature-aware Design

Currently at Korea Development Bank

Hyeon Kook Kim

hk0619@gmail.com

• SSD Thermal Management

Currently at SK Hynix

Seon Young Kim

seonyoung8436@etri.re.kr

• OS-level Thermal Management
• Thermal-aware VM Allocation

Currently at ETRI

Hyeong Kon Bae

iqoong@korea.ac.kr

• 3D Stacked Architecture
• High Bandwidth Memory (HBM)
• Processing in Memory (PIM)
• Error Correction Code (ECC)

Currently at Samsung Electronics DS

Gun Hee Park

parkgh7124@gmail.com

• 3D Stacked Architecture
• Processing in Memory (PIM)

Currently at SK Hynix

Ho Seok Kim

thomas1324@korea.ac.kr

• High Bandwidth Memory (HBM)
• Error Correction Code (ECC)

Currently, Ph.D. student at Purdue University