Ji Hun Kwon (jkwon11@korea.ac.kr)

3D Stacked Architecture
High Bandwidth Memory (HBM)
Processing in Memory (PIM)
Temperature-aware Design

Hyeong Kon Bae (iqoong@korea.ac.kr)

3D Stacked Architecture
High Bandwidth Memory (HBM)
Processing in Memory (PIM)
Temperature-aware Design