M.S Student

         

     

    Ji Hun Kwon (jkwon11@korea.ac.kr)

      3D Stacked Architecture
      High Bandwidth Memory (HBM)
      Processing in Memory (PIM)
      Temperature-aware Design

         

     

    Hyeong Kon Bae (iqoong@korea.ac.kr)

      3D Stacked Architecture
      High Bandwidth Memory (HBM)
      Processing in Memory (PIM)
      Temperature-aware Design