Current Projects 

  • "Thermal Aware In-memory Accelerators Based on 3D Stacked Memories", sponsored by KRF from March 2020 ~ February 2025.
  • "System-Level Thermal Management Technique for 2.5D and 3D Stacked Structures considering the Surrounding Environment", sponsored by an Industry from September 2020 ~ September 2025.
  • "Memory-Centric Architecture Using the Reconfigurable PIM Devices", sponsored by IITP from April 2022 ~ December 2028.

    Selected Past Projects

  • "DRAM Based Memory Hierarchy Design and Application", sponsored by an Industry from September 2020 ~ August 2023.
  • "Development of Low Temperature Process Based M3D Integration Device and Circuit Platform with Si/SiGe Layer", sponsored by KRF from July 2020 ~ February 2023.
  • "Development of Thermal Management Technique for Supercomputer CPU", sponsored by KRF from July 2020 ~ March 2022.
  • "Development of Energy-/Thermal- Optimal System SW in a Single Node", sponsored by KRF from November 2017 ~ March 2021.
  • "Development of Architectures considering Characteristics and Process of Application", sponsored by an Industry from July 2016 ~ June 2020.
  • "Monolithic 3D Integration Architecture and Process Development for Low Power IoT Device Platform", sponsored by KRF from October 2015 ~ August 2020.
  • "System-level Design and Analysis Platform for Neuromorphic Interconnects with Monolithic 3D", sponsored by KRF from June 2016 ~ February 2020.
  • "PIM Core Technology and System Development for Data-intensive Applications", sponsored by an Industry from April 2018 ~ March 2020.
  • "Resource-aware Power Management for Various Mobile Devices Connected via Wireless Networks", sponsored by KRF from November 2015 ~ October 2017.
  • "Development of the Core Technology for Battery-life Extension of Wearable Devices for Smart Disaster Relief”, sponsored by KRF from December 2014 ~ October 2017
  • "Performance/Power Modeling of High Bandwidth Memory (HBM)”, sponsored by an Industry from December 2014 ~ November 2016.
  • "Development of the Thermal Modeling Tool for Mobile Microprocessors”, sponsored by an Industry from August 2014 ~ July 2015.
  • "Development of the Power Modeling Tool and Energy-Efficient Task Scheduler for Mobile Multi-core Processors", sponsored by an Industry from August 2011 ~ July 2015.
  • "Multi-dimensional Smart IT Convergence System”, sponsored by MSIP from September 2011 ~ August 2013.
  • "Battery Characteristics based Power Management for Smartphones”, sponsored by KRF from May 2012 ~ April 2015.
  • "Development of the Octa-level Heterogeneous Multicore Software Platform Technology and the Establishment of Sustainable Open Infrastructure Targeting on Small and Medium Enterprises for Strengthening the Software Industry Competitiveness", sponsored by ETRI from December 2011 ~ November 2014.
  • "Multi-dimensional Smart IT Convergence System”, sponsored by MSIP from September 2011 ~ August 2013.
  • "User-aware Power Management for Green Computing", sponsored by KRF from May 2010 ~ April 2013.
  • "Thermal Management Techniques Reflecting Dynamic Environment Changes: Integration of Computer and Mechanical Engineering Analysis", sponsored by KRF from July 2008 ~ June 2009.
  • "A New Methodology for Design and Verification of CPU/DSP Considering Changes of Process Technology", sponsored by KOSEF from September 2007 ~ August 2010.
  • "Temperature-Aware Design for Reliable Microprocessors", sponsored by KRF from July 2006 ~ June 2009.
  • "Performance Analysis of Multimedia Streaming Depending on Storage Performance", sponsored by PeeringPortal form September 2007 ~ August 2008.
  • "Novel System Architecture for SSD (Solid State Disk)", sponsored by Samsung Electronics from Feb. 2007~Jan. 2008
  • "Temperature-Aware Microarchitecture", sponsored by Korea University from March 2006 to Feb. 2007.
  • "Temperature-Aware Scheduling", sponsored by KITA and University of Virginia from March 2005 to Jan. 2006.
  • "Explorationof On-Chip Bus Architecture and Its Memory Controller", in Samsung Electronics from July 2004 to Feb. 2005.
  • "Development of the Next Generation Embedded Processor", in Samsung Electronics from Jan. 2003 to July 2004.
  • "Development of Dual Ring-Bus Snoop-Based Scalable CC-NUMA Architecture", NRL(National Research Laboratory) Project sponsored by Ministry of Science and Technology from Sept.1999 to Dec. 2002
  • "Study on the Parallel Computer for Image Processing", BK21 Project sponsored by Ministry of Education and Human Resource Development from Sept. 1999 to Dec. 2002
  • "Performance Evaluation of the interconnection network chip, called CANOPUS", sponsored by IBM T. J. Watson Research Center and KRF(Korea Research Foundation) from Jan. 2002 till July 2002
  • "Study on the Development of Design Technology for the Large Scale Computer", sponsored by Ministry of Commerce, Industry & Energy from 1996 till 1998
  • "A Study on Research Planning for the Development of a Successive Model of the Enterprise Server", sponsored by Ministry of Commerce, Industry & Energy from 1996 till 1998
  • "Cache Performance Tracer", sponsored by Samsung Electronics in 1997
  • "Design of Transformation from III.3 to SMP node", sponsored by Hyundai Information of Technology from 1996 till 1997