Current Projects 

  • "Development of the Core Technology for Battery-life Extension of Wearable Devices for Smart Disaster Relief”, sponsored by KRF from December 2014 ~ October 2017
  • "Performance/Power Modeling of High Bandwidth Memory (HBM)”, sponsored by an Industry from December 2014 ~ November 2016.
  • "Resource-aware Power Management for Various Mobile Devices Connected via Wireless Networks", sponsored by KRF from November 2015 ~ October 2017.
  • "Monolithic 3D Integration Architecture and Process Development for Low Power IoT Device Platform", sponsored by KRF from August 2015 ~ April 2020.
  • "System-level Design and Analysis Platform for Neuromorphic Interconnects with Monolithic 3D", sponsored by KRF from June 2016 ~ February 2021.
  • "Development of the Architecture Considering Application Characteristic and Process Technology", sponsored by an Industry from July 2015 ~ December 2020.

    Selected Past Projects

  • "Development of the Thermal Modeling Tool for Mobile Microprocessors”, sponsored by an Industry from August 2014 ~ July 2015.
  • "Development of the Power Modeling Tool and Energy-Efficient Task Scheduler for Mobile Multi-core Processors", sponsored by an Industry from August 2011 ~ July 2015.
  • "Multi-dimensional Smart IT Convergence System”, sponsored by MSIP from September 2011 ~ August 2013.
  • "Battery Characteristics based Power Management for Smartphones”, sponsored by KRF from May 2012 ~ April 2015.
  • "Development of the Octa-level Heterogeneous Multicore Software Platform Technology and the Establishment of Sustainable Open Infrastructure Targeting on Small and Medium Enterprises for Strengthening the Software Industry Competitiveness", sponsored by ETRI from December 2011 ~ November 2014.
  • "Multi-dimensional Smart IT Convergence System”, sponsored by MSIP from September 2011 ~ August 2013.
  • "User-aware Power Management for Green Computing", sponsored by KRF from May 2010 ~ April 2013.
  • "Thermal Management Techniques Reflecting Dynamic Environment Changes: Integration of Computer and Mechanical Engineering Analysis", sponsored by KRF from July 2008 ~ June 2009.
  • "A New Methodology for Design and Verification of CPU/DSP Considering Changes of Process Technology", sponsored by KOSEF from September 2007 ~ August 2010.
  • "Temperature-Aware Design for Reliable Microprocessors", sponsored by KRF from July 2006 ~ June 2009.
  • "Performance Analysis of Multimedia Streaming Depending on Storage Performance", sponsored by PeeringPortal form September 2007 ~ August 2008.
  • "Novel System Architecture for SSD (Solid State Disk)", sponsored by Samsung Electronics from Feb. 2007~Jan. 2008
  • "Temperature-Aware Microarchitecture", sponsored by Korea University from March 2006 to Feb. 2007.
  • "Temperature-Aware Scheduling", sponsored by KITA and University of Virginia from March 2005 to Jan. 2006.
  • "Explorationof On-Chip Bus Architecture and Its Memory Controller", in Samsung Electronics from July 2004 to Feb. 2005.
  • "Development of the Next Generation Embedded Processor", in Samsung Electronics from Jan. 2003 to July 2004.
  • "Development of Dual Ring-Bus Snoop-Based Scalable CC-NUMA Architecture", NRL(National Research Laboratory) Project sponsored by Ministry of Science and Technology from Sept.1999 to Dec. 2002
  • "Study on the Parallel Computer for Image Processing", BK21 Project sponsored by Ministry of Education and Human Resource Development from Sept. 1999 to Dec. 2002
  • "Performance Evaluation of the interconnection network chip, called CANOPUS", sponsored by IBM T. J. Watson Research Center and KRF(Korea Research Foundation) from Jan. 2002 till July 2002
  • "Study on the Development of Design Technology for the Large Scale Computer", sponsored by Ministry of Commerce, Industry & Energy from 1996 till 1998
  • "A Study on Research Planning for the Development of a Successive Model of the Enterprise Server", sponsored by Ministry of Commerce, Industry & Energy from 1996 till 1998
  • "Cache Performance Tracer", sponsored by Samsung Electronics in 1997
  • "Design of Transformation from III.3 to SMP node", sponsored by Hyundai Information of Technology from 1996 till 1997