- [DATE] Hyeong Kon Bae, Myung Jae Chung, Young-Ho Gong and Sung Woo Chung, “Twin ECC: A Data Duplication Based ECC for Strong DRAM Error Resilience”, Design, Automation and Test in Europe Conference (DATE 2023), Antwerp, Belgium, April 2023.
- [DATE] Young Seo Lee, Gunjae Koo, Young-Ho Gong and Sung Woo Chung, “Stealth ECC: A Data-Width Aware Adaptive ECC Scheme for DRAM Error Resilience”, Design, Automation and Test in Europe Conference (DATE 2022), Antwerp, Belgium, March 2022.
- [ICCD] Young Seo Lee, Kyung Min Kim, Ji Heon Lee, Jeong Hwan Choi, and Sung Woo Chung, “A High-Performance Processing-in-Memory Accelerator for Inline Data Deduplication”, IEEE International Conference on Computer Design (ICCD 2019), Abu Dhabi, UAE, November 2019.
- [ISLPED] Cong Thuan Do, Young-Ho Gong, Cheol Hong Kim, Seon Wook Kim, and Sung Woo Chung, “Exploring the Relation between Monolithic 3D L1 GPU Cache Capacity and Warp Scheduling Efficiency”, IEEE/ACM International Symposium on Low Power Electronics and Design (ISLPED 2019), Lausanne, Switzerland, July 2019.
- [ISLPED] Young Geun Kim, Jeong In Kim, Seung Hun Choi, Seon Young Kim, and Sung Woo Chung, “Temperature-aware Adaptive VM Allocation in Heterogeneous Data Centers”, IEEE/ACM International Symposium on Low Power Electronics and Design (ISLPED 2019), Lausanne, Switzerland, July 2019.
- [ISLPED] Young Geun Kim and Sung Woo Chung, “Signal Strength-aware Adaptive Offloading for Energy Efficient Mobile Devices”, IEEE/ACM International Symposium on Low Power Electronics and Design (ISLPED 2017), Taipei, Taiwan, July 2017.
- [ISLPED] Joonho Kong, Young-Ho Gong, and Sung Woo Chung, “Architecting Large-Scale SRAM Arrays with Monolithic 3D Integration”, IEEE/ACM International Symposium on Low Power Electronics and Design (ISLPED 2017), Taipei, Taiwan, July 2017.
- [DATE] Young Geun Kim, Minyong Kim, Jae Min Kim, and Sung Woo Chung, “M-DTM: Migration-based Dynamic Thermal Management for Heterogeneous Mobile Multi-core Processors”, Design, Automation and Test in Europe Conference (DATE 2015), Grenoble, France, March 2015.
- [DAC] Joonho Kong and Sung Woo Chung, "Exploiting Narrow-width Values for Process Variation-tolerant 3D Microprocessors", Design Automation Conference (DAC), San Francisco, CA, June 2012.
- [ICCD] Hyung Beom Jang, Jinhang Choi, Ikroh Yoon, Sung-Soo Lim, Seungwon Shin, Naehyuck Chang, and Sung Woo Chung, "Exploiting Application-dependent Ambient Temperature for Accurate Architectural Simulation", IEEE International Conference on Computer Design (ICCD 2010), Amsterdam, Netherlands, October 2010.
- [ICCAD] Donghwa Shin, Jihun Kim, Jinhang Choi, Sung Woo Chung, Eui-Young Chung, and Naehyuck Chang, "Energy-Optimal Dynamic Thermal Management for Green Computing", IEEE/ACM International Conference on Computer-Aided Design (ICCAD 2009), San Jose, CA, USA, November 2009.
- [ICCD] Hyung Beom Jang, Ikroh Yoon, Cheol Hong Kim, Seungwon Shin, and Sung Woo Chung, "The Impact of Liquid Cooling on 3D Multi-Core Processors", IEEE International Conference on Computer Design (ICCD 2009), Lake Tahoe, CA, USA, October 2009.
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[DAC] Yan Pan, Joonho Kong, Serkan Ozdemir, Gokhan Memik, and Sung Woo Chung, "Selective Wordline Voltage Boosting for Caches to Manage Yield under Process Variations", Design Automation Conference (DAC), San Francisco, CA, July 2009.
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[DATE] Shuai Wang, Jie Hu, Sotirios G. Ziavras, and Sung Woo Chung, "Exploiting Narrow-Width Values for Thermal-Aware Register File Designs", Design, Automation and Test in Europe Conference (DATE'09), Nice, France, April 2009.